onsemi, a leader in intelligent power and sensor technology, has announced a series of new MOSFET devices featuring innovative top cooling to assist designers in complex automotive applications, particularly in motor control and DC-to-DC conversion.
MUNICH – November 15, 2022 – onsemi (Nasdaq: ON), a leader in intelligent power and sensor technology, has announced a series of new MOSFET devices featuring innovative top cooling to assist designers in complex automotive applications, particularly in motor control and conversion DC/DC. The company is showcasing the new devices at its booth 101 in Hall C4 at Electronica, the world’s leading electronics trade show and conference.
Housed in a TCPAK57 package measuring just 5mm x 7mm, the new Top Cool devices feature a 16.5mm2 thermal pad on top. This allows heat to be dissipated directly to the heatsink rather than via a typical printed circuit board (PCB). By allowing both sides of the PCB to be used and reducing the amount of heat entering the PCB, the TCPAK57 provides increased power density. The improved reliability of the new design increases the overall life of the system.
“Cooling is one of the most important challenges in high-power design, and its successful solution is a key factor in reducing size and weight, which is very important in today’s automotive design,” said Fabio Necca, vice president and general manager of Automotive Power Solutions at onsemi. . “By providing excellent electrical efficiency and removing the PCB from the thermal path, the design is greatly simplified while reducing size and cost.”
The devices provide the electrical efficiency required in high power applications with RDS(ON) values as low as 1mΩ. In addition, the gate charge (Qg) is low (65 nC), which reduces losses in high-speed switching applications.
This solution leverages Onsemi’s deep packaging expertise to provide the highest power density solution in the industry. The initial TCPAK57 portfolio includes 40V, 60V and 80V. All devices are capable of operating at junction temperatures (Tj) of 175°C, meet AEC-Q101 and PPAP requirements. This, along with gullwings that allow inspection of solder joints, and superior board-level reliability make them ideal for demanding automotive applications. Target applications are high/medium power engine controls such as power steering and oil pumps.
SOURCE: onsemi
https://www.automotiveworld.com/news-releases/onsemi-launches-mosfets-with-innovative-top-cool-packaging/
